1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for IC chip repairs. 2. Made of high-quality stainless steel, it s heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time. 3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands. 4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield. 5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments. 6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, ing cost-effectiveness and significantly lowering repair costs.
