1. Selection of high-quality materials, no rust, high toughness, and corrosion resistance. 2. The surface adopts vacuum plating process, which will not fade. 3. Laser cutting, neat edges without burrs, uniform shape. 4. The blade is polished by hand, carefully polished by the first-line maintenance master, and directly used without polishing. 5. Ma1.0 can be used to pry IC and CPU glue removal. 6. Ma2.0 is a corner knife, which can be used to scrape the glue around the IC. 7. Ma3.0 is a -shaped rubber tapping knife, which can cut vinyl without damaging the board.
