1. 3D laser square hole BGA reballing stencil template. 2. High-speed numerical control technology and high-temperature resistant toughened materials production, round square precise hole position, make steel net more durable, easier to take off the net, more efficient. 3. Suitable for iPhone 12 Pro / 12 Middle layer motherboard. 4. High temperature resistant synthetic stone made positioning slot. 5. Assisting professionals to do BGA reballing in the most convenient and safest way.