1. ly designed for ultra-thin and flat cutting, allowing precise removal of underfill glue and solder pads without damaging nearby components. 2. Engineered to quickly cut through tough underfill glue around IC chips, significantly improving repair efficiency during motherboard rework. 3. Made of high-hardness stainless steel for wear resistance, ensuring a long lifespan even under continuous use. 4. I for technicians working on BGA, CPU, NAND, or other micro soldering tasks, ely suitable for high-density PCB boards. 5. Ultra-thin blade tip reaches narrow gaps under chips and small components, making it a must-have tool for precision electronic repairs. 6. Fully compatible with blade handle systems, ensuring secure installation and comfortable grip during delicate operations.
