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A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max / XS / XR
A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max / XS / XR
A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max / XS / XR
A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max / XS / XR

A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max / XS / XR

Regular price
₹ 617.00
Sale price
₹ 617.00
Regular price
₹ 647.00
Taxes included.
In Stock

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🚚Shipping & Processing Time: All orders are processed within 1–2 business days. Estimated delivery time of 18–20 Business Days.

📦Returns & Refunds: Returns accepted within 14 days of delivery for defective, damaged, or incorrect items. Items must be unused and in original condition.
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Details
1. Professional tool for mobile phones repairing.
2. Suitable for iPhone XS Max / XS / XR.
3. The holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. steel manufacturing, high temperature resistance, no deformation.